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Launch: TC570 COM Express Type 6 Module, #Recab

Logotyp: Recab
Logotyp: Recab

TC570 COM Express Type 6 Compact module from congatec, based on 11th Gen Intel® Core™ processor family, code name ”Tiger Lake”

A Small COM Express Type 6 Compact module based on 11th Gen Intel® Core™. The PCIe Gen 4 support gives massive bandwidth to external peripherals. The TC570 have a High-performance CPU/GPU compute with integrated AI acceleration for critical applications. It supports up to 4 x 4K displays in multi display applications (Or 2x 8K).

Key Features:
Formfactor: COM Express Compact

DRAM: Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s

Ethernet: 1 x GbE TSN Ethernet via Intel® i225

I/O Interfaces

8 x PCI Express GEN 3.0 lanes
PEG support x4 (PCIe Gen4)
4 x USB 3.1 Gen2
8 x USB 2.0
2 x SATA III (6Gb/s)
2 x UART
8 x GPIOs
Graphics: Integrated Xe (Gen 12) graphics engine | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | HDMI 2.0/2.1 | DP 1.4

congatec Board Controller: Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection

Security: Trusted Platform Module (TPM 2.0)

Power Management: ACPI 5.0 with battery support

Temperature: Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C

Humidity: Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Size: 95 x 95 mm (3,74″ x 3,74″)

Se hela nyheten på Recab.com